收藏本站
Chapter 2
Hardware Preparation and Installation
This chapter provides unpacking instructions and hardware preparation for the
MPC8272ADS.
2.1
Unpacking Instructions
If the shipping carton is damaged upon receipt, request that the carrier ’s agent is present
during unpacking and inspection of equipment. Unpack the equipment from shipping
carton. and refer to the packing list to verify that all items are included. Save the packing
material for storing and reshipping the equipment.
NOTE
Avoid touching areas of integrated circuitry. Static discharge
can damage the circuits of this product.
2.2
Hardware Preparation
To ensure that the desired configuration is selected to produce proper operation of the
MPC8272ADS board, changes of the dip-switch settings may be required before
installation. The location of the switches, indicators, dip-switches, and connectors is
illustrated in Figure 2-1. Boards are factory-tested and shipped with dip-switch settings as
described in the following tested graphs. Parameters can be changed for the following
conditions:
The PowerQUICC II internal logic supply level within range (V DDL ) using potentiometer
RP1.
?
?
?
?
?
PowerQUICC II’s MODCK(1:3). Determining core’s and CPM’s PLLs
multiplication factor using dip-switches SW5(#6 - #8)
PowerQUICC II’s hard reset configuration word source - BCSR or memory
(FLASH/EEPROM) using jumper JP9
PowerQUICC II’s boot code source EEPROM/FLASH using dip-switch SW2(1)
PowerQUICC II’s MODCKH(0:3) using SW5(1-4)
PowerQUICC II’s PCI_ARBITER using SW2(2)
Chapter 2. Hardware Preparation and Installation
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
MPC8308-RDB BOARD REF DESIGN MPC8308
MPC8309-KIT KIT EVALUATION FOR MPC830X
MPC8315E-RDB PROCESSOR BOARD PWRQUICCII PBGA
MPC8349E-MITX-GP KIT REFERENCE PLATFORM MPC8349E
MPC8349E-MITXE BOARD REFERENCE FOR MPC8349
MPC8377E-MDS-PB BOARD MODULAR DEV SYSTEM
MPC8569E-MDS-PB BOARD MOD DEV SYSTEM MPC8569
MPC8572EAMC MPC8572 AMC RAPID SYSTEM
相关代理商/技术参数
MPC8272CVR 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications
MPC8272CVRB 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8272CVRE 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8272CVRI 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8272CVRM 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8272CVRMIBA 功能描述:微处理器 - MPU 266 MHz 505.4 MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8272CVRP 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8272CVRPIEA 功能描述:微处理器 - MPU 300 MHz 570 MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324