
Chapter 2
Hardware Preparation and Installation
This chapter provides unpacking instructions and hardware preparation for the
MPC8272ADS.
2.1
Unpacking Instructions
If the shipping carton is damaged upon receipt, request that the carrier ’s agent is present
during unpacking and inspection of equipment. Unpack the equipment from shipping
carton. and refer to the packing list to verify that all items are included. Save the packing
material for storing and reshipping the equipment.
NOTE
Avoid touching areas of integrated circuitry. Static discharge
can damage the circuits of this product.
2.2
Hardware Preparation
To ensure that the desired configuration is selected to produce proper operation of the
MPC8272ADS board, changes of the dip-switch settings may be required before
installation. The location of the switches, indicators, dip-switches, and connectors is
illustrated in Figure 2-1. Boards are factory-tested and shipped with dip-switch settings as
described in the following tested graphs. Parameters can be changed for the following
conditions:
The PowerQUICC II internal logic supply level within range (V DDL ) using potentiometer
RP1.
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PowerQUICC II’s MODCK(1:3). Determining core’s and CPM’s PLLs
multiplication factor using dip-switches SW5(#6 - #8)
PowerQUICC II’s hard reset configuration word source - BCSR or memory
(FLASH/EEPROM) using jumper JP9
PowerQUICC II’s boot code source EEPROM/FLASH using dip-switch SW2(1)
PowerQUICC II’s MODCKH(0:3) using SW5(1-4)
PowerQUICC II’s PCI_ARBITER using SW2(2)
Chapter 2. Hardware Preparation and Installation